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Processing

Materials: Cutting, grinding, lap-polish, ultrasonic welding and blasting

Brittle: Ceramics, silicon, quartz, glass, carbon, etc.

Metal: Stainless steel, Aluminum alloys, Titanium alloys, high melting point metal such as Tungsten, Molybdenum, Tantalum, etc.

Unlock Enhanced Semiconductor Performance - Explore the Advantages of Semiconductor Baffles in Wafer Processing. Improve Contamination Control & Optimize Yield. Your Premier Source for Semiconductor Baffle Solutions.

General Semiconductor Services

TKF Tech strives to provide the semiconductor industry with a wide variety of standard & custom components of the highest quality. 

 

Whether you require electrostatic chuck services, or something more general like surface treatments, rest assured that TKF Tech can make it!

We also offer engineering services and and have offered support to the semiconductor industry for years. We can design custom solutions and trouble shoot your problems, or provide other unique services to help reduce down time and improving your PM cycle.

 

TKF Tech strives to meet all customer service requests. If you need something that isn't listed below, feel free to contact a TKF Tech product and application consultant and let our knowledgeable staff help you design the perfect part for your needs.

See the options we have for O-rings, gaskets, and custom molded parts.

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Semicon Products

Coatings, Packaging and Services

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Surface Treatment

Anodization: By using a novel anodize oxidation coating generating method developed by a special electrolyte and the electrolysis method, an oxide film much harder than the usual anodize oxidation coatings is obtained. In addition, we also respond to consultation for various hard anodizing.

Thermal Spraying: The coating material is melted or softened by heating and then turned into fine particles and made to impact into the object to be coated. By solidifying and depositing flatly crushed particles, thermal spraying is a kind of technology to form coating. We can respond to various types of thermal spraying, such as air plasma spraying, decompression plasma spraying, and high-speed flame spraying.

Plating: Highly efficient plating based on the non-electrolyzed plating method, giving outstanding adhesion strength and electrical conductivity, which cannot be realized by conventional methods, such as sputtering, vapor deposition and printing calcinations method.

Al, Ceramics, Al/SiC, Non-Electrolysis Plating Method for Resin Materials: Ion plating Reaction gas (nitrogen, acetylene, etc.) is blown into the place, where the plating substance has been heated, evaporated and ionized. Under this circumstance, a hard metallic compound particle is produced by metal ion and reaction gas. It is a method of producing a hard coating by making the particle impact very strongly on the frame surface to which a negative (-) voltage has been applied. We respond to consultation regarding various types of coatings.

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Bonding

Vacuum Brazing: Brazing is the technology of bonding base materials without melting the joint part (unlike commonly known welding by melting the joint part). Please consult our company for bonding between different types of materials.

Precision Bonding: Using organic and inorganic system bonding

Electron-Beam Bonding: The electron emitted from the filament heated in vacuum is accelerated by high voltage of several 10kV to near the velocity of light, and furthermore it is sharply concentrated using an electron lens. The intense heat produced from the electrons colliding into a minute surface is used in welding. This is called electron-beam bonding.

Metal Bonding: TIG welding TIG welding is a welding method of using a heat-resistant tungsten electrode (T), and passing inactive gas (inert gas, I) around it. Since there is no oxygen (air) in a welding part and the material is not oxidized, it is the greatest feature in the welding of stainless steel or an aluminum alloy. In addition, it is also called argon welding since argon is used in many cases for inactive gas. Please consult our company for welding between different types of materials.

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Other

Aluminum High-Pressure Casting: By performing oxygen substitution and casting the gas in a die, products with few cast cavities (blowholes) resulting from the contamination of gas can be manufactured. Since there is little contamination of gas, heat treating and welding are possible, and it is suitable for components subjected to high pressure and quality die-casting products with few blowholes of a sliding surface. Components are also available upon consultation.

Ultrasonic Fine Hole Processing Machine: It is the processing method, which pressurizes the tool that performs supersonic vibration perpendicularly through the processing liquid, which mixes the abrasive, and crushes a work piece minutely with the impact of grinding particles

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Testing

Vacuum: Vacuum leak, ultimate vacuum, gas discharge characteristics.

Thermal: Surface temperature distribution measurement by IR thermograph (inside a vacuum chamber), Temperature distribution measurement of the heater using various temperature-measuring tools, and a wafer stage.

Dimension: Various types of measuring instruments, such as 2D measuring instrument, 3D measuring instrument, surface roughness tester and coating thickness meter

Surface analysis: SEM, EPMA, X-ray Fluorescence Spectrometer, Sequential Plasma Spectrometer

Ensure Flawless Semiconductor Parts with Precise Testing Solutions - Discover Advanced Testing Techniques for Optimal Performance & Reliability. Your Trusted Source for High-Quality Semiconductor Testing Services. Elevate Your Semiconductor Manufacturing Process Today.

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Groove Design References

Coatings, Packaging, & Other Services

Custom Parts & Custom O-rings

Chamber Components

TKF Tech offers a wide variety of newly manufactured and refurbished chamber components for many OEM tools. The same strict quality standard is used for stripping anodization and re-anodizing parts. The unique re-anodization process and component refurbishing process saves customers millions of dollars in new part consumption. Example parts are shown below on Tokyo Electron tools:

  • Baffle plates, slanted and not slanted, new and refurbished

  • Upper electrode, Vespel® and non-Vespel® types

  • Focus rings, Aluminum, Silicon, ALN, Quartz and Ceramic

  • Depo shields, new and refurbished

  • Anodized Depo window, unique non-screw design

  • Cover bellows, new and refurbished

  • Polyimide and Ceramic E-chucks

  • Screws, fasteners and other components

Other OEM components include Amat TXZ® and DXZ® refurbished Ceramic and ALN heaters, Lam redesigned Silicon electrodes, Sapphire components, Anodized GDP, Anodized showerheads and many more. Please contact us with a reference number, drawing or description and we will provide pricing and availability as soon as possible.


Advanced thermally sprayed chamber components:

Have a particle or Aluminum Floride (ALF) problem in your process? Is it possible that it's being released from your Aluminum chamber components? The best solution is state of the art thermally sprayed chamber components in Al2O3 or Y2O3.

Many modern OEM tools are introduced with a Y2O3 coating, but we are able to apply this new technology to existing 200 mm chamber components.

The powders used are extremely pure, preserving the cleanliness of your process. Please contact us for more information on this technology. We can coat an entire chamber kit, Baffle plate, anode, bellow cover, window depo, and more.

Please contact us if you have more questions.

Discover the Power of Electrostatic Chucks - Revolutionize Semiconductor Manufacturing with Precision Wafer Handling and Static Elimination. Explore Cutting-edge Technology & Applications. Your Go-To Resource for Electrostatic Chucks in Semiconductor Fabrication.
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